• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a hollow body-shaped, baked product and to a method and an apparatus for producing the product, which is at least partially formed from a consumable, baked Wafflefladen which deformable in the hot state and during and / or after the forming process has a solidified, cup-shaped form wherein the wafer patties are supplied to a thermoforming opening in the hot, moldable state, preformed by a preforming device in the fold areas, and deep drawn from a stamper into a thermoforming opening, wherein, influenced by the preforming, the crimp areas of each individual wafer stack overlap in a multilayer manner during the deep-drawing process.
    公开号:AT511751A1
    申请号:T1086/2011
    申请日:2011-07-25
    公开日:2013-02-15
    发明作者:
    申请人:Franz Haas Waffel Und Keksanlagen Ind Gmbh；
    IPC主号:
    专利说明:

    1 ** 49348 / GP / FI
    Method and device for producing a hollow body-shaped baked product
    The invention relates to a hollow body-shaped, baked product and to a method and an apparatus for producing the product, which is at least partially formed from a consumable, baked Wafflefladen which deformable in the hot state and during and / or after the forming process has a solidified, cup-shaped form ,
    The hollow-body-shaped baked product is at least partially made of baking compounds or dough was formed for long-life bakery products of flours and / or starches, preferably doughs and baking compounds are used, as exemplified in WO 00/05966 disclosed.
    The simple method of baking a flat Waffelstückes combined with the ability to plastify this at the baking temperature or just below by the molten sugar content and thus still easily mechanically nachformen, but then by simply and quickly cooling the sugar to solidify and to stabilize the resulting shape. It also gives a brittle, hard product. These wafers consisting essentially of a starch-sugar (sugar substitute) protein mixture are below the glass point at room temperature. Moreover, the sugar content is mostly solidified as a glassy melt and therefore very crisp in texture.
    Typical sugar contents are for example for rolled ice cream cones 30 to 50 wt .-% based on flour or 60 to 100 wt .-% in hollow sticks.
    Methods and apparatus for shaping waffle-like long-life bakery goods are also known and accordingly also entered into the patent literature.
    2 49348 / GP / FI
    The AT 384 933 B, for example, shows an apparatus and a method for producing rolled, preferably conical hollow wafers. From single, in particular sugar-containing dough baked wafer patties, in which the wafer patties are first rolled in the back soft, moldable state to a particular shape of the hollow waffles and then allowed to solidify in this shape, each wafer patty is first rolled freely to the predetermined shape of the hollow waffle, and wherein then the finished rolled hollow waffle is calibrated by plastic deformation of edge regions to a predetermined longitudinal extension of the hollow waffle and further then the calibrated hollow waffle is allowed to solidify.
    These rolled bags have been proven in practice because of their properties such as stability, appearance, feel, workability, filling, etc, and thus belong to the most commonly encountered waffle-like hollow body shapes.
    An alternative device for producing a wafer product is shown in DE 10 005 500 A1. In this case, a wafer product is thermoformed with side walls, which are preferably arranged vertically opposite in the upper region, wherein the wafer product is created by pushing a substantially planar Waffelstückes by a forming die into a corresponding mold and wherein the upper edge of the preferably perpendicular opposite side walls of the deep-drawn wafer product flush is cut. The likewise disclosed production method is comparable to the forming method of drop forging. The wafer is pressed after baking in a hot and thus deformable state of a stamp in a die and thereby squeezed between these two elements.
    Another method for forming a consumable hollow vessel made of wafer dough is WO 99/33348. In this case, a likewise substantially flat wafer sheet is pulled by means of a punch in a die. Due to the geometrical conditions, in particular the proportions between the circumference of the baked wafer roll and the circumference of the opening of the finished hollow vessel, it can occur that wrinkling occurs in the region of the opening.
    3 49348 / GP / FI
    In practice, it has been found that it may be desirable to provide edible hollow-bodied, baked products, in particular consumable hollow vessels made of wafer-like doughs or baking compounds, with reinforcing ribs in order to positively influence their stability and their physical properties. The execution of ribs, however, is limited in the production method mentioned above in that, after solidification, thicker areas have different physical properties, and e.g. soft or too hard. In order nevertheless to provide thicker areas in waffle products, it is therefore advantageous to carry out these areas in multiple layers. The wrinkling during a deep drawing process is one way to achieve this multi-layered.
    A disadvantage of the prior art is that it is not possible to provide targeted structures of multi-layered areas in hollow body-shaped, baked products or consumable hollow vessels that the stability, appearance, physical properties, crispness, the "dining experience" and the sound when eating etc . improve.
    Object of the present invention is to provide a hollow body-shaped baked product and a method and apparatus for producing a product according to the invention, which overcomes the disadvantages of the prior art and also low in manufacturing, flexible in shape, flexible in the control the wrinkle structure and is efficient to manufacture.
    The object is achieved in that the wafer cakes fed in the hot, moldable state of a deep-drawn, preformed by a preforming device in the fold areas, and are deep drawn by a stamp in a deep-drawn, wherein influenced by the preforming, the fold areas of each wafer wafer Deep-drawing process over several layers.
    Furthermore, the present invention is advantageously characterized in that the wafer patty is positioned over the thermoforming opening and is brought from the preforming device from a substantially planar shape into a preformed shape arched in the crimping areas such that the preformed wafer crust of the thermoforming process of FIG. in the fold areas arched shape
    4 49348 / GP / FI is brought into a substantially cup-shaped form and / or that during the deep-drawing process, the curved fold areas are first formed Ω-shaped and subsequently multi-layered one above the other.
    According to further advantageous features, it can be provided that the wafer flat is round, oval, rectangular, polygonal, square, star-shaped or any other shape in which the longitudinal extent exceeds the thickness many times that of the wafer flat in the preforming, the position the wrinkle areas controllable form is given, that the wafer flat is fed along the transfer surface of the deep draw, centered by centering over the deep draw, is preformed by the preforming device and deep drawn by the punch of the deep drawing device in the deep draw, thereby and / or cooled thereafter and solidified and then ejected from the ejection device from the thermoforming opening and / or that the wafer flat initially positioned flat on the drawing ring on the thermoforming opening, held there by a holding force, then from the Vorwölbelementen the preforming device in the folds areas against the holding force bulged and then deep-drawn by the punch of the thermoforming device in the thermoforming opening.
    In addition, inventive features that the stamp from a position outside the thermoforming opening is at least partially inserted into the deep draw opening linearly and thereby pulls the wafer flat in the thermoforming opening and / or that the wafer crust consists of a dough or a baking mass which is a plasticizer , in particular a temperature-dependent plasticizer, such as sugar, erythritol and / or xylitol.
    The hollow body-shaped, baked product which is at least partially formed from a consumable, baked waffle flat, which in the hot state formable and during and / or after the forming process has a cup-shaped form, is characterized in that the product has multi-layered executed fold areas, the symmetrical , Rotationally symmetrical and / or regularly distributed around the circumference are arranged so that the main directions of extension of the fold areas substantially normal to the Bocherrand direction cup base, that the fold areas at least two layers, preferably three layers executed
    * * Ί * * 49348 / GP / FI and / or that the tine areas are substantially contiguous, following the shape of the cup.
    Furthermore, the invention relates to an apparatus for producing a hollow-shaped, baked product, comprising a thermoforming device with a thermoforming opening, over which a baked, moldable and solidifiable waffle patties can be positioned, and with a punch, which via a punch moving device from a position outside the thermoforming opening in this is at least partially insertable, which is characterized in that in the region of the thermoforming opening a preforming device for preforming the wafer flat is provided, that the preforming device comprises preforming elements, which are arranged in the region of the fold areas of the wafer flat and preferably in the direction waffle pattes extendable, that the thermoforming opening is provided substantially surrounding drawing ring is held on the wafer flat with a holding force and / or that the drawing ring is arranged parallel to or in the transfer area.
    Furthermore, features of the invention according to the device that at least one centering extension for centering and / or positioning of the wafer flat is provided over the thermoforming opening that the centering projecting beyond the pull ring against the holding force, that the Vorwölbelemente of a retracted position in which they are substantially in the Transfer surface are sunk, in an extended position in which you overlook the drawing ring, can be brought and / or that a drive is provided for moving the Vorwölbelemente.
    It should be noted that the terms deep-drawn hole,
    Drawing ring, blank and stamp are common terms from the metal forming technology. The use of these terms is for the clarity and clarity of the application. However, these terms are by no means to be interpreted as limiting to your usual use in metal forming technology. For example, as a thermoforming mold, a mold containing a cavity is designated in which the blank is deep-drawn by the stamp. This thermoforming mold can have a shaping function similar to a die - but does not have to. Thus, it depends on the volume of the deep-drawn Ronde and the remaining volume between the fully inserted punch and the thermoforming mold, whether the Ronde in the resulting gap
    6 49348 / GP / FI is crimped or free deep drawn so that the blank does not touch the thermoforming mold. By suitable choice of the shape of the punch and the thermoforming mold, the shape and surface of the edible hollow body can be determined. By providing an embossing stamp or a relief in the deep-drawing mold or on the stamp, for example, the waffle body can be embossed with a specific texture. When free deep drawing, so without large-scale investment or crushing of the thermoforming mold, the lattice-shaped surface embossing of the baking tongs of the oven 1 is maintained.
    The term Ronde is not limited to round, flat patty-shaped body of baking masses or pasta for long-life bakery goods. Thus, it also corresponds to the idea of the invention to choose rectangular, oval, star-shaped, polygonal, waffle-patty-shaped or other circular blanks. Preferably, the Ronde is formed as a wafer flat.
    The invention will be described in more detail below with reference to different embodiments:
    Fig. 1 shows a schematic representation of an edible body manufacturing system according to the invention, Fig. 1A being a side view and Fig. 1B being a top view.
    2 shows a diagrammatically illustrated oblique view of the relevant apparatus for producing the edible body in position A,
    Fig. 3 shows a schematic sectional view of the relevant parts of the apparatus for producing the edible body, also in position A.
    4 shows a schematic oblique view of the device in position B.
    Fig. 5 shows a schematic sectional view of a detail of the device in position B.
    6 shows an oblique view of a detail of the device in position C,
    7 49348 / GP / FI
    7 shows a schematic sectional view of the device in section C.
    Fig. 8 shows an oblique view (schematically) of a detail of the device in position D.
    Fig. 9 shows the device according to the previous figures in line E, and
    FIG. 10 shows a sectional view of the device according to FIG. 9.
    FIGS. 11 to 14 show schematic plan views of the edge of the blank during the forming with the desired formation of wrinkles.
    FIG. 15 shows a side view of a hollow body-shaped baked product according to the invention, FIG.
    16 shows a further embodiment of a baked hollow body according to the invention.
    FIG. 17 shows a plan view from above, looking into the cup-shaped hollow body from FIG. 16.
    Fig. 1 shows a schematic view of an arrangement of a baking oven for the processing of the blanks, which are preferably formed as wafer flat.
    1a shows a side view of a baking oven with the device according to the invention for the production of the baked product, and FIG. 1b shows a top view of a baking oven and the device for producing the hollow body-shaped baked product.
    The oven is preferably designed as Waffelbackofen with encircling baking tongs and includes a discharge station of the oven 1 at the back of the wafer wafer, which can also be referred to as Ronde, removed from the individually opening baking tongs and from the transfer device 2 to the forming device
    8 49348 / GP / FI 3 is handed over. In the present embodiment, this transfer is done by gripper 4, which are arranged rotatably about the rotation axis 5 of the transfer device 2, the wafer patties touch from above and subsequently in a rotational movement about the rotation axis 5 along a substantially horizontally extending transfer surface 6 of the forming device 3 feed. The forming device 3 comprises at least one, preferably a plurality of deep drawing devices, which are rotatable about the axis of rotation 7 of the forming device 3 movable. The speed of the rotating baking tongs and the angular velocities of the transfer device and the forming device are synchronized such that each time you open a baking tongs the back soft, still malleable wafer flat 8 or the round, removed from the transfer device 2 and in a uniform rotational movement of the forming device 3, in particular each one circulating deep drawing device 9 is supplied. The absolute average speed of the wafer flat on the transfer device is greater than the speed of the wafer flat on the U forming device. During the rotation of the wafer cakes on the forming device 3 about the axis 7 of the wafer cakes 8 is deep drawn with the process steps described below. The process steps comprise the positions A, B, C, D, E, which are preferably run through in this order. At the end of the shaping process, the deep-drawn edible body, ie the hollow body-shaped baked product, is transferred from a removal device 10 to a post-conditioning device 11. The take-off device 10 comprises a rotatable decrease, which lines the baked products linearly. Subsequently, a plurality of linearly juxtaposed baked products substantially normal to the linear juxtaposition of Nachconditioniervorrichtung supplied. In this example, the edible bodies can be precooled, greased and finally cooled or else coated with a coating of e.g. Be provided with chocolate.
    Fig. 2 shows a schematic oblique view of an embodiment of the deep-drawing device 9 according to the invention. The device is in position A at which the punch 16 is arranged by the punch moving device 17 in the raised position, away from the back-soft waffle flat 8. The wafer flat
    9 49348 / GP / FI 8 is outside the thermoforming mold 13 and the thermoforming opening 14, which has a draw ring 15, positioned.
    As noted in the description of FIG. 1, the wafer cake, coming from the oven, is fed by a transfer device to the forming apparatus. For positioning the wafer flat centering extensions 20 are provided, which protrude from the Basisfiäche 21 of the forming device, so as to act as a stop and for centering the wafer flat over the thermoforming opening. In addition to the illustrated cylindrical design, it is also possible to change the stop elements differently, e.g. by depressions in the base surface 21 or by stop strips and the like to realize. In this embodiment, four centering extensions 20 are provided. The use of a smaller number of these stop elements can bring advantages in the feedability of the wafer flat. Thus, in this or another embodiment, the base surface 21 of the forming device can be designed in alignment with the transfer surface 6, wherein the blank is slidably supplied over both surfaces and are stripped from the gripper 4 at the centering extensions 20, which serve as Anschiagelemente. When four centering extensions are used, the transfer surface 6 is mounted higher than the base surface 21 of the shaping device by a certain amount, preferably around the fleas of the centering extensions 20. Thus, the wafer flat is pushed over the centering extensions and then positioned by gravity on the deep drawing mold opening and stored centered by the centering extensions 20.
    The waffle flat 8 is positioned as shown in FIGS. 2 and 3 above the deep-drawn opening 14, that is to say on the drawing ring 15 of the deep-drawing device 9. The drawing ring is in this embodiment in the transfer area 6 of the forming device 3. Held the wafer flat by gravity, which is parallel to the direction of movement 18 of the Stempelbewegungsvorrightung 17 in the present configuration. In a different or alternative configuration, the wafer flat may also be held by the centrifugal force which acts outwards when the forming device 3 is rotating. Furthermore, it is also part of the invention, apart from acceleration forces by acceleration of gravity or centrifugal accelerations also to obtain holding forces by vacuum devices but also by mechanical holders and the like. 10 49348 / GP / Ff
    In position A, the wafer flat lies flat on the transfer surface 6, in particular on the drawing ring 15 above the thermoforming opening and, accordingly, over the thermoforming mold 13. The term "over" refers to the schematic representation as shown in FIG. In practice, it sometimes happens that the low stiffness of the wafer flat creates a sag in the deep-drawn opening. Although the waffle flat partially protrudes into the deep-drawn opening, the improvement in clarity and simplicity is subsequently referred to as "over" the deep-drawn opening.
    The actuation of the punch moving device for moving the punch 16 in the direction of movement 18 is given in this embodiment by a pneumatic arrangement such as linear drives, pneumatic cylinders, etc. Of course, it is part of the idea Erent idea this linear movement by hydraulic, electrical or mechanical moving devices such as hydraulic cylinders, linear motors, linear drives, Sliding control etc. to perform.
    FIG. 3 shows a sectional view of the forming device 3 in position A according to FIG. 2. In this case, the wafer flat 8 is again positioned above the deep-drawn opening 14 or the deep-drawing mold 13 on the drawing ring 15. The punch 16 and the punch moving device are in position A, so in the raised position. Furthermore, the ejection device 19 is shown, which is formed in this embodiment as a spring-biased punch.
    In addition, 3 Vorwölbelemente 22 can be seen in the sectional view of FIG. In position A according to FIGS. 2 and 3, these are sunk completely in the base surface 21.
    4 shows a schematic oblique view of the device in position B. In this case, the protrusion elements 22 are extended counter to the holding force in such a way that they protrude beyond the base surface 21 and give the wafer flat a multiply arched shape and preform it in particular in the fold regions 23.
    11 49348 / GP / FI
    The wafer flat is thus brought from a substantially planar shape by the Vorwölbelemente in a multi-curved shape.
    Fig. 5 also shows the device in position B, but in a schematic sectional view. Although the bulging waffle patty 8 lies centrally in the region of the ejection device 19 above the deep-drawn opening, it is curved in its edge region by the protruding elements 22 in the direction of the punch 16. The stamp itself can be moved during the protrusion or even after the protrusion is completed, towards the deep-drawing opening and further into the deep-drawing opening.
    In Fig. 6 is an oblique view of the relevant parts of the forming device in position C is shown. In this case, the punch 16 through the
    Stamp moving device 17 is pushed through the thermoforming opening 14 and the drawing ring 15 in the thermoforming mold 13. Similar to a deep-drawing process, the round blank or the wafer flat is pulled into the thermoforming mold.
    Also, Fig. 7 shows the thermoforming device 9 in position C, but in a sectional view. In this case, the waffle flat 8 is cup-shaped deformed between the punch 16 and the thermoforming mold 13 is arranged, the spring-tensioned, guided in the direction of movement of the punch moving device mounted ejector 19 is from an extended position, as shown in Fig. 3, from the stamp in a prestressed Position pressed.
    Optionally, in the region of the drawing ring, a cutting arrangement can be provided which cooperates with a cutting ring 24 of the punch in order to separate the wafer flat in the region of the cup rim from the projection. In the present embodiment, a cutting ring 24 is provided on the punch, which cooperates with the stop ring 25. When retracting the punch in the thermoforming opening of the cutting ring 24 is pressed with its cutting edge on the Anschiagring 25. The present geometry cuts the wafer cakes along the cutting edge of the cutting ring 24.
    • «*» »* 15 4934Ö / GP / FI
    It should be noted that in the present form an annular cutting ring is provided. However, it is entirely consistent with the idea of the invention, the cutting ring oval, rectangular, star-shaped or any conceivable contour following, in particular any conceivable closed contour following train.
    By retracting the punch 16, the ejector 19 is biased. The force of the punch acts over the wafer flat to tension an elastic element of the ejection device 19.
    Fig. 8 shows an oblique view of the same embodiment of the device, however, in position D.
    In this process step, the punch 16 moves out of the thermoforming mold 13 again. By the spring-biased ejector 19, the molded, from the gun sharpened, now cup-shaped and at least partially solidified and dimensionally stable baked product 12 or the edible body is pressed with the stamp from the thermoforming mold. In the process, the deep-fried waffle flat that has been formed into the product retains the desired shape.
    Fig. 9 shows the same arrangement, but in position E in which the stamp is fully drawn out of the edible body, wherein the edible body, which was formed from the wafer flat, is also pressed out of the thermoforming mold 13 by the ejector 19 entirely.
    FIG. 10 shows a sectional view of the device according to FIG. 9. The extended ejector device 19, the hollow-body-shaped baked product 12 positioned thereon, and the stamp 16 of the deep-drawing device 9 pulled out of the product can again be seen.
    In the deep-drawing movement according to the invention, as shown for example in FIGS. 2 to 7 in a preferred sequence, wrinkling of the wafer cake or of the hollow-body-shaped, baked product occurs due to the geometric and physical conditions. This wrinkling is desired as mentioned above and gives the finished product a number of advantageous
    13 49348 / GP / FI
    Properties. The formation of the folds is shown in detail in FIGS. 11 to 14. These show a schematic sectional view of a segment, in particular a fold region 23 of the edge of the wafer flat, which corresponds to the edge of the hollow body-shaped, baked product by the inventive deformation in the finished state. The protrusion by the Vorwölbelemente 22 (see for example in Fig. 4) gives the wafer flat a shape that allows wrinkling at desired positions and / or favors. In the present case, three Vorwölbelemente are provided, whereby a targeted wrinkling is achieved in three areas of the wafer flat. These fold areas 23 of the waffle flat 8 are slightly bulged at the beginning of the deep-drawing process against the deep-drawing direction, the waffle flat extending substantially normal to the deep-drawing direction. If the stamp penetrates into the deep-drawing opening 14 and the deep-drawing mold 13, then the wafer flat is converted into a cup-shaped body. The side walls of the cup-shaped body are bent from the basic position in the direction of thermoforming punch. Since the circumference of the flat waffle flat is greater than the circumference of the cup rim of the finished cup-shaped product, the desired wrinkling occurs, in particular in the cup rim area but also in an area in the vicinity of the cup bottom. At the beginning of the deep-drawing movement, the fold regions 23 form Ω-shaped (omega-shaped) bulges as shown in FIG. 11.
    Upon further penetration and deep drawing of the wafer flat, these Ω-shaped bulges are folded more and more, as shown in FIGS. 12 and 13.
    If the stamp retracts completely or almost completely into the deep drawing form, the desired fold shape according to FIG. 14 is formed. It should be noted that this is a possible wrinkle shape. By suitable choice of the protrusion elements e.g. asymmetric Vorwölbelemente, oblique Vorwölbelemente, but also by the number of Vorwölbelemente it is according to the concept of the invention possible to achieve other folds.
    As a result of the fold shape, as illustrated, for example, in FIG. 14, the waffle flat has a constant thickness during the baking process and receives the desired reinforced areas only through the targeted folding in the fold regions 23. If the protruding elements were not provided, wrinkles would also be created, but they would not be able to be positioned in a targeted manner, so that the folds of each individual waffle flat would arise at different points. This brings in particular
    14 49348 / GP / FI in mass production a high reject rate of waffles by, for example, cracking, irregular arrangement of the folds, etc. with it. In the present invention, a choice of the position of the fold areas is possible. Preferably, folds are arranged along symmetrical or rotationally symmetrical patterns.
    Fig. 15 shows an embodiment of a possible baked deep-drawn product. This has an edge 26, a bottom 27, a jacket 28 and fold regions 23. In the present embodiment, the edge is designed to project laterally cantilevered. This collar-shaped or bent design increases the stability and durability of the edge.
    FIG. 16 shows a further embodiment of a baked product 12 according to the invention in a side view. The product comprises a rim 26, a bottom 27, a jacket 28 and fold regions 23. The embodiment shown is cup-shaped. However, it also corresponds to the idea of the invention, the baked product spherical, hemispherical, cylindrical, conical, cubic, or cuboid etc. execute.
    17 shows a view of a baked product according to the invention according to FIG. 16 from above. Again, the edge 26, the bottom 27, the jacket 28 and the fold regions 23 are shown. The fold regions 23 are, as noted, overlaid several times. The present illustration is a schematic representation. In practice, it may happen that in particular the multiply superimposed areas are squeezed by the punch and thus that the wafer flat is made thinner in this area than in the remaining areas of the shell 28. Thus, despite the Multi-ply in the pleat areas have a constant total wall thickness along the entire shell.
    In the present embodiment of FIG. 17, two fold regions 23 are regularly distributed on the circumference. However, it also corresponds to the inventive idea to provide more than two, in particular three, four, five, six or more fold regions. • «« «* *» · * Φ 4 • · «» f i f · t # Φ ·· v · »t -2 · * 4
    49348 / GP / FI 15
    In the embodiments shown, the folds are bulged by the Vorwölbelemente 22. However, it is entirely within the meaning of the invention that no counter to the thermoforming extending extending Vorwölbelemente be used, but for example depressions or cutouts in the region of the drawing ring or in the region of the base surface of the forming device are provided. Thus, in a further embodiment, not shown, in the area of the drawing ring and in the area of the deep-drawing opening, cutouts are provided into which areas of the back-soft ronde, in particular the hot, shapeable wafer patty, are drawn by gravity or another holding force before the deep-drawing process and during the deep-drawing process , This configuration also forms fold areas, which lead to the desired, targeted wrinkling during the deep-drawing process.
    At this point, it should be noted that the invention is not limited to the stated embodiments. Further embodiments corresponding to the concept of the invention also result from combinations of individual or several features which can be taken from the entire description, the figures and / or the claims. Thus, embodiments are disclosed that consist of combinations of features that come from different embodiments. The figures are at least partially schematic representations, wherein the dimensions and proportions of other, not graphically illustrated, embodiments or features as well as real versions may differ.
    16 49348 / GP / FI
    Reference numeral 1 Oven 2 Transfer device 3 Forming device 4 Gripper 5 Rotary axis of the transfer device 6 Transfer surface 7 Rotation axis of the forming device 8 Wafflefladen 9 thermoforming device 10 removal device 11 Nachkonditioniervorrichtung 12 Shaped baked product 13 Deep-drawing mold 14 deep drawing 15 draw ring 16 punch 17 punch moving device 18 movement direction of the punch moving device 19 ejector 20 centering 21 Base surface of the forming device 22 Vorwölbelemente 23 fold areas 24 cutting ring 25 stop ring 26 edge 27 bottom 28 shell
    权利要求:
    Claims (22)
    [1]
    17 49348 / GP / FI claims 1. A process for the preparation of hollow body, baked products of consumable, baked Waffenifladen that are formed in the hot, moldable state and cooled during and / or after the forming process and thus solidified, characterized in that the Wafflefladen fed in the hot, moldable state of a deep-drawn opening, preformed by a preforming device in the fold areas, and deep drawn by a stamp in a deep-drawn, wherein, influenced by the preforming, the fold areas of each wafer wafer during the deep-drawing process overlay one another.
    [2]
    2. The method according to claim 1, characterized in that the wafer flat is positioned over the deep draw opening and is brought by the preforming device from a substantially planar shape into a, in the fold areas curved, preformed shape.
    [3]
    3. The method according to claim 1 or 2, characterized in that the preformed wafer flat is brought into a substantially cup-shaped form during deep-drawing of a, curved in the fold areas shape.
    [4]
    4. The method according to any one of claims 1 to 3, characterized in that the deep-drawing process, the curved fold areas are first formed Ω-shaped and subsequently multi-layered one above the other.
    [5]
    5. The method according to any one of claims 1 to 4, characterized in that the wafer flat round, oval, rectangular, polygonal, square, star-shaped or any other shape corresponds, in which the longitudinal extent exceeds the thickness of a multiple. ··· «* *« * * * * * t * * * * * * * * * * * * * * * * · · · · · · · · · · · · · · ····· ...... 49348 / GP / FI
    [6]
    6. The method according to any one of claims 1 to 5, characterized in that the wafer flat is given in the preforming, the position of the fold areas controllable shape.
    [7]
    7. The method according to any one of claims 1 to 6, characterized in that the waffle flat is fed along the transfer surface of the deep-drawing, centering of centering over the deep-drawn opening is preformed by the preforming device and deep drawn by the punch of the deep-drawing device in the deep-drawn, thereby and / or thereafter cooled and solidified and then ejected from the ejection device from the thermoforming opening.
    [8]
    8. The method according to any one of claims 1 to 7, characterized in that the wafer flat first positioned flat on the drawing ring on the thermoforming opening, held there by a holding force, then arched by the Vorwölbelementen the preforming device in the fold areas against the holding force and then from the Stamp of the thermoforming device is deep-drawn into the thermoforming opening.
    [9]
    9. The method according to any one of claims 1 to 8, characterized in that the stamp is introduced from a position outside of the deep-drawing opening substantially linearly at least partially in the deep-drawn opening and thereby pulls the wafer flat with in the deep-drawn opening.
    [10]
    10. The method according to any one of claims 1 to 9, characterized in that the wafer patty consists of a dough or a baking mass containing a plasticizer, in particular a temperature-dependent plasticizer, such as sugar, erythritol and / or xylitol. • a * * * ♦ • • I * * * ti »li« * ·· • · · · · «« ········· 49348 / GP / FI
    [11]
    11. A hollow-bodied, baked product which is at least partially formed from a consumable, baked waffle flat, which can be deformed in the hot state and has a cup-shaped form during and / or after the forming process, characterized in that the product has multi-layered fold regions which are symmetrical, arranged rotationally symmetrical and / or regularly distributed on the circumference.
    [12]
    12. Hollow-bodied, baked product according to claim 11, characterized in that the main directions of extension of the fold regions extend substantially normal to the cup rim in the direction of the cup bottom.
    [13]
    13. Hollow-bodied, baked product according to one of claims 11 or 12, characterized in that the fold regions are at least two-ply, preferably three-ply.
    [14]
    14, hollow body-shaped, baked product according to one of claims 11 to 12, characterized in that the fold regions are substantially fitting, following the shape of the cup.
    [15]
    15. An apparatus for producing a hollow-bodied, baked product, comprising: a thermoforming device with a thermoforming opening, over which a baked, moldable and solidifiable wafer flat can be positioned, and with a stamp, which at least partially via a stamp moving device from a position outside the thermoforming opening is insertable, characterized in that in the region of the thermoforming opening a preforming device is provided for preforming the wafer flat.
    [16]
    16. The apparatus according to claim 15, characterized in that the preforming device comprises preform elements, which are arranged in the region of the fold regions of the wafer flat and are preferably extendable in the direction of wafer flat. 20 49348 / GP / FI
    [17]
    17. The device according to any one of claims 15 or 16, characterized in that a, the deep-drawn opening substantially surrounding draw ring is provided on which the wafer flat is held with a holding force.
    [18]
    18. Device according to one of claims 15 to 17, characterized in that the drawing ring is arranged parallel to or in the transfer area.
    [19]
    19. Device according to one of claims 15 to 18, characterized in that at least one centering extension is provided for centering and / or positioning of the wafer flat over the deep-drawn opening.
    [20]
    20. Device according to one of claims 15 to 19, characterized in that the centering extensions project beyond the drawing ring against the holding force.
    [21]
    21. The device according to one of claims 15 to 20, characterized in that the Vorwölbelemente of a retracted position in which they are substantially recessed in the transfer area, in an extended position in which you extend beyond the drawing ring can be brought.
    [22]
    22. Device according to one of claims 15 to 21, characterized in that a drive is provided for moving the Vorwölbelemente.

    Puchb "

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    同族专利:
    公开号 | 公开日
    CN102894051B|2017-08-29|
    JP2013022020A|2013-02-04|
    EP2550865B1|2015-07-15|
    BR102012018362A2|2013-12-03|
    BR102012018362B1|2019-09-24|
    US20130029014A1|2013-01-31|
    RU2587555C2|2016-06-20|
    KR20130012576A|2013-02-04|
    US9259008B2|2016-02-16|
    CA2783311A1|2013-01-25|
    RU2012133352A|2014-01-27|
    PL2550865T3|2015-12-31|
    AT511751B1|2013-11-15|
    MY157479A|2016-06-15|
    CN102894051A|2013-01-30|
    EP2550865A1|2013-01-30|
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    法律状态:
    2021-03-15| MM01| Lapse because of not paying annual fees|Effective date: 20200725 |
    优先权:
    申请号 | 申请日 | 专利标题
    ATA1086/2011A|AT511751B1|2011-07-25|2011-07-25|METHOD AND DEVICE FOR PRODUCING A HOLLOW-BODY BAKED PRODUCT|ATA1086/2011A| AT511751B1|2011-07-25|2011-07-25|METHOD AND DEVICE FOR PRODUCING A HOLLOW-BODY BAKED PRODUCT|
    PL12176806T| PL2550865T3|2011-07-25|2012-07-18|Method and device for producing a baked product in the shape of a hollow body|
    EP12176806.3A| EP2550865B1|2011-07-25|2012-07-18|Method and device for producing a baked product in the shape of a hollow body|
    CA2783311A| CA2783311A1|2011-07-25|2012-07-19|Method and apparatus for making a hollow baked product|
    JP2012163497A| JP2013022020A|2011-07-25|2012-07-24|Method and device of making hollow baked product|
    US13/556,239| US9259008B2|2011-07-25|2012-07-24|Method and apparatus for making a hollow baked product|
    BR102012018362-5A| BR102012018362B1|2011-07-25|2012-07-24|PROCESS FOR MANUFACTURING OF BAKED PRODUCTS, BAKED BROWN PRODUCT AND DEVICE FOR MANUFACTURING THE SAME|
    RU2012133352/13A| RU2587555C2|2011-07-25|2012-07-25|Method and device for production of hollow baked product|
    CN201210259189.7A| CN102894051B|2011-07-25|2012-07-25|Method and apparatus for the product of the baking that manufactures hollow body shape|
    KR1020120081212A| KR20130012576A|2011-07-25|2012-07-25|Method and apparatus for making a hollow baked product|
    MYPI2012003362A| MY157479A|2011-07-25|2012-07-25|Method and apparatus for making a hollow baked product|
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